§ The E1M™ platform · v1.0
Open edge AI, vendor-neutral.
Pin-compatible modules from Alif, NXP, Renesas, DeepX — two footprints, one contract. One SDK. Hardware engineers and AI builders shouldn't have to choose.
# Same file. Any module.
som:
sku: E1M-V2N101
preset: e1m-x-evk
cores:
a55_cluster:
app: ./linux
peripherals: [ethernet, usb, emmc]
m33_sm:
app: ./m33
peripherals: [adc, pwm, i2c, gpio]6
E1M modules · one SDK
132×
AI compute range
2
Pin-compatible form factors
4
Silicon vendors · 1 API
§ Any silicon
Two footprints. One contract. Swap silicon, keep your carrier.
Every module in a footprint family lands on the same pads — change vendors without redesigning your base board. The spec and the SDK span both families.
E1M
35 × 35 mm · 312 pads
pin-compatible within E1M
E1M-X
45 × 65 mm · 496 pads
pin-compatible within E1M-X
§ E1M™ product line
AI performance that scales with your needs.
From 0.25–0.5 TOPS always-on sensing to 33 TOPS heterogeneous compute — same unified Alp SDK, same C/C++ API, same toolchain. Lower expenses with custom-built SoM options; shape your module to include only the functions that matter.
- MCU+MPU
- 2×M55 + opt. A32
- NPU
- 2× Ethos-U55
- Form
- 35×35 · 312p
- Power
- <1 mW always-on
Coming soon
- CPU
- 2×A55 @ 1.7 GHz
- NPU
- Ethos-U65 (500 GOPS)
- Form
- 35×35 · 312p
- TSN
- 2× 1 GbE TSN
- CPU
- 4×A55 @ 1.8GHz
- NPU
- 4 TOPS
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3
- CPU
- 4×A55 + 2×R8
- NPU
- 80 TOPS (sparse)
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3·2×ETH
- CPU
- 4×A55 @ 1.8GHz
- NPU
- 29 TOPS
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3·2×ETH
- CPU
- 4×A55 + 2×R8
- NPU
- 33 TOPS dense
- Form
- 45×65 · 496p
- IFC
- MIPI·PCIe·USB3·2×ETH
§ Pocket-sized AI
Same compute. A fraction of the footprint.
Drawn to scale relative to each other — what fits where your product needs to go.
-
1 Euro coin
Ø 23.25 mm
-
E1M
35 × 35 mm · 312 pads
-
E1M-X
45 × 65 mm · 496 pads
Drawn to scale relative to each other. Both modules fit in the palm of your hand.
§ Edge AI development · AI modules for robotics
Powering the future of robotics and smart manufacturing.
Smart machines need smart brains. Alp Lab delivers that intelligence through advanced Edge AI hardware — modules that help machines think, work, and react more efficiently in real-world conditions.
Open Standard
Hardware-agnostic, pin-to-pin compatible modules in two footprints, from any silicon vendor. Build once, deploy everywhere.
Unified SDK
One SDK across all modules. Streamline development with consistent APIs and tools.
Industrial Reliability
Built for harsh environments + 10-year minimum supply. Extended temperature, vibration resistance, and a written lifecycle commitment.
Edge AI Performance
Optimized for AI workloads at the edge. Run complex models locally with minimal latency.
§ Portfolio compatibility
Replace what you need. Keep what you trust.
Our E1M portfolio offers full footprint compatibility — seamless upgrades or downgrades without redesigning the base hardware. A vendor-agnostic approach that gives you flexibility and freedom of choice.
Flexible Edge AI system-on-module architecture: high-performance compute in a compact design. Small, powerful modules that handle heavy workloads while keeping response times low — ideal for industrial automation and busy factory floors.
1 carrier · any conformant module
Same footprint, every chip
E1M · E1M-X
35×35 mm / 45×65 mm
§ The Alp SDK stack
Write once, run on any E1M module.
One unified C/C++ API across every E1M SoM — Alp SDK wraps each vendor SDK on top of your chosen OS, so a single application builds for Zephyr, Yocto, bare-metal, or any mix.
AI Framework
On-device inference
Ethos-U DRP-AI3 DEEPX TFLM runtime · classification · detection · segmentation · KWS · pose
Dev Tooling
Build, orchestrate, flash
v0.6.0
Codegen Validate Flash EEPROM board.yaml v2 · per-core emit · west alp-build / image / flash · validators
Alp SDK
One unified <alp/*.h> API
unified <alp/*.h> API · 80+ chip drivers · heterogeneous IPC
Operating System
Per-core slice (cores: in board.yaml) · heterogeneous = peers on same SoM
Bare-metal per-core slice · M-class on Zephyr · A-class on Yocto · no-RTOS bare-metal
Vendor SDK
We wrap each one
one wrapper per vendor — same alp API regardless of silicon
Hardware + HAL
E1M open-standard form factor
open-standard form factors · pin-compatible across silicon
80+ chip drivers · heterogeneous IPC · per-core OS slices
§ Solutions by industry
Purpose-built edge AI for every vertical.
The best edge AI for robotics, manufacturing, and beyond — enabling machines to see, learn, and move. Built on a proven SoM platform that turns bold ideas into real, working edge AI products.
Drones & UAVs
Autonomous flight, on-device
Real-time AI processing for autonomous flight, object detection, and mission planning — no cloud round-trip.
Read the vertical brief →
Robotics
See, learn, move
AI-powered automation, collaborative robots, and smart robotic systems for modern industry.
Read the vertical brief →
Industrial automation
Inspect, predict, optimize
Visual inspection, predictive maintenance, and process optimization at the edge.
Read the vertical brief →
Agriculture
Precision farming, autonomous
AI-powered crop monitoring and autonomous farm equipment running independently in the field.
Read the vertical brief →
Energy
Real-time grid + solar
Smart grid monitoring, solar tracking, and equipment diagnostics measured at the asset.
Read the vertical brief →
Smart infrastructure
City sensing, privacy-first
People counting, traffic flow, energy monitoring — AI at the sensor, never streams raw video.
Read the vertical brief →
§ E1M™ SoM hardware + Alp SDK™
Industrial Camera — Smart Eye.
The Alp Lab Smart Camera is a lightweight, all-in-one industrial AI camera with customization options — designed for manufacturing, robotics, warehouse automation, and workplace safety.
- · Renesas V2N AI processor with longevity support
- · DeepX M1 AI accelerator, high performance, low power
- · Lightweight IP67 housing for harsh-environment mobility
§ E1M™ open standard · v1.0
An open standard, not a walled garden.
The E1M specification fixes the carrier-board pinout, mechanical envelope, and electrical interface of two form factors — 35 × 35 mm (312 pads) and 45 × 65 mm (496 pads). A single carrier board hosts any silicon that conforms.
Published under CC BY-SA 4.0. Machine-readable pinouts. Third parties welcome.
E1M · "Normal"
35 × 35 mm
312 pads · LGA
- Ethernet
- 2
- USB 3.x
- 1
- MIPI CSI
- 2
- PCIe 4-lane
- 1
Hosts: AEN · N93
E1M-X · "Extended"
45 × 65 mm
496 pads · LGA · + parallel LCD
- Ethernet
- 2
- USB 3.x
- 2
- MIPI CSI
- 4
- PCIe 4-lane
- 2
Hosts: V2N · V2H · +M1 variants
§ Open source
Built in the open. No NDAs.
The E1M Standard and the Alp SDK live on GitHub under
CC BY-SA 4.0 +
Apache-2.0. Read the
spec, file an issue, send a PR.
alplabai/
E1M Standard
Open-standard module pinout, mechanical, electrical spec
Latest commit · 10 d ago
c298c73 docs(changelog): drop major-bump caveat — nothing released yet (#5)
Read the repo ↗
alplabai/
Alp SDK
Unified C/C++ API · heterogeneous build · vendor SDK wrappers
Latest commit · 6 d ago
637a692 Merge pull request #113 from alplabai/release/v0.7.0-bump
Read the repo ↗
§ Silicon partners
Built on industry-leading silicon.
We wrap every vendor's SDK under one C/C++ API on top of Arm CMSIS, so you ship the same firmware regardless of which silicon ends up under the module.
Renesas Partner Program
RZ/V2N · V2H · DRP-AI3 on E1M-X
MCU + edge-NPU partner
Ensemble E3–E8 on E1M-AEN
AI accelerator partner
DX-M1 on V2N+M1 and V2H+M1
Long-term silicon commitments. Industrial-grade longevity. Shared roadmaps.
§ Authorised distributors
Sourcing E1M, worldwide.
Order modules, dev kits, and production quantities through our channel network — local stock, local logistics, local support.
§ Trusted by innovators
What teams are building on E1M.
" By integrating Alp Lab's E1M Alif Module, we enabled real-time predictive maintenance at the edge, quickly detecting rail faults. This improved reliability and cut both maintenance costs and data transmission. "
Ali Acur
CTO · Delphisonic ↗
" Thanks to Alp Lab's E1M module, we added AI vision to our drone in weeks. We doubled our camera inputs while halving power consumption compared to our previous platform. "
M. Salih Cetin
CEO · Mavinci Dynamics ↗
" Integrating Alp Lab's E1M Alif Module streamlined our hydronic device development. The platform enabled rapid addition of advanced features with reliable performance and low power use. "
Sezer Sener
CTO · Rhodark ↗
§ Developer resources
Everything you need to build edge AI applications.
Ready to build the future?